ST by leaps and bounds
29
Mar
2024
If everyone expected a Cortex-M55 or M85 during the March 19th event, ST created the surprise by announcing 18nm FD-SOI and ePCM memory with promises of dramatic power consumption and noise reductions. If it comes true in 2025 and the technology allows for decent latency, it could provide an unfair advantage to ST MCUs, wireless and others. We will likely see it first in slower MCU product lines unless paired with memory caches.
No change, the website is unusually slow.
Microchip added parts to their new AVR DU family based on the former Atmel AVR16 core, running at up to 24 MHz, 1.8V to 5.5V. The family includes 16 KB, 32 KB, and 64 KB Flash variants in 14 to 32-pin package options. The main attribute of the AVR DU is a USB 2.0 Full Speed device. In total there were 133 additions, all variants of existing products, and mostly in the PIC16F1xxxx realm.
No change this month.
No change this month.
NXP expanded the Kinetis E (MKE) series with a handful of parts in the KE1xZ – mainstream with touch family.
Prices for the KE1xZ range from $1@10k to $3@10k. A number of old MK11D/MK21DX parts were retired too.
Renesas was quite active this month with update in many areas.
The RA2A2 group was disclosed with 12 parts. It features low-power with a 48MHz Cortex-M23 core and a segment LCD controller.
There were over 300 new parts in the RL78/D1A (Automotive Low-end Instrument Clusters) and G1A (Low Power, GP with High-resolution A/D Converter) groups.
Finally, the RX family had another 100 parts spread across the RX111, RX62 and RX63.
No change.
There was a flurry of annoucements last month on technology and products.
On the technology front, ST announced an advanced process based on 18nm Fully Depleted Silicon On Insulator (FD-SOI) technology with embedded phase change memory (ePCM) to support next-generation embedded processing devices. This new process technology, co-developed by ST and Samsung Foundry, is bound to deliver a leap in performance and power consumption for embedded processing applications while allowing larger memory sizes and higher levels of integration of analog and digital peripherals.
The first next-generation STM32 microcontroller based on the new technology will sample before the end of 2024, with production planned for the second half of 2025.
Compared to ST 40nm embedded non-volatile memory (eNVM) technology used today, 18nm FD-SOI with ePCM improves key figures of merit:
- More than 50% better performance-to-power ratio
- 2.5-times higher non-volatile memory (NVM) density enabling larger on-chip memories
- Three times higher digital density for integration of digital peripherals such as AI and graphics accelerators and state-of-the-art security and safety features
- 3dB improvement in noise figure for enhanced RF performance in wireless MCUs
It is the only sub-20 nm technology supporting 3V operation to supply analog features such as power management, reset systems, clock sources and digital/analog converters.
It is unclear what speed and memory latency we should expect as this has been a bottleneck of the technology.
On the products front, ST unveiled the STM32H7R/S with 36 part numbers. These 600 MHz Cortex-M7 MCUs feature an impressive array of peripherals including I3C, USB HS w. PHY and UCPD.
The the R3/S3 variants add FMC and xSPI up to 200 MHz with XiP and MCE, Chrom-ART and JPEG Codec while the R7S7 upgrade to a NeoChrom GPU, Jpeg codec and TFT LCD controller.
At the other end of the spectrum, ST released the STM32U0 series, based on the more modest Cortex-M0+ core at 56 MHz. It targets SESIP Level 3, PSA-Certified Level 1, and NIST certifications. From low to high features, here are some details on the portfolio:
- The STM32U031x line offers up to 64 Kbytes of flash memory, 12 Kbytes of SRAM and comes in eight packages from 20 to 64 pins, in TSSOP, WLCSP, UFQFPN, LQFP, and UFBGA. It features a 12-bit ADC and capacitive sensing channels.
- The STM32U073x line offers from 16 to 256 Kbytes of flash memory, 40 Kbytes of SRAM and comes in eight packages from 32 to 81 pins, in UFQFPN, WLCSP, LQFP, and UFBGA. It adds a USB and a LCD controller to the STM32U031.
- The STM32U083x line offers 256 Kbytes of flash memory, 40 Kbytes of SRAM and comes in eight packages from 32 to 81 pins, in UFQFPN, WLCSP, LQFP, and UFBGA. It embeds an AES accelerator.
- Supporting the latest protocols (Bluetooth® Low Energy 5.4, IEEE 802.15.4 communication protocols, Zigbee®, Thread and Matter), the STM32WBA54/55 line brings designers flexibility while ensuring enhanced security. Bluetooth 5.4 audio streaming is also supported.
117 part numbers were released.
TI released about a dozen variants of existing parts.
No sign of Cortex-M55/85 yet
29
Feb
2024
While everyone is expecting the launch of Cortex-M55/85 at Infineon, NXP and ST, NXP unveiled the MXC N and MXC A, both based on a secure Cortex-M33, in a single or dual core configuration fitted with a neural processing unit to accelerate machine learning algorithms. More modestly, Nuvoton introduced a few more Cortex-M4 devices to their portfolio.
Infineon introduced over 150 new part numbers, alas, they are derivatives of existing parts, mostly in the Automotive PSoC™ 4100S Max families (CY8C4147/8/9). No trace yet of the PSoC™ Edge family, dubbed “the next generation of MCUs for Machine Learning”.
Only minor changes to the portfolio.
No change this month.
Nuvoton launched the NuMicro® M433 CAN/USB FS series. It is a 144 MHz Cortex-M4-based family focused on low power IoT, industrial, and consumer applications. It supports an operating voltage of 1.8V to 3.6V, and temperature from – 40C to 105C. It provides up to 128 KB Flash memory for code storage and 64 KB SRAM for run time operation.
The M433 CAN/USB FS series supports plenty of peripherals, including 2 sets of CAN, USB FS OTG, up to 18 channels of 16-bit PWM, 4 sets of UART, 2 sets of SPI/I2S, 1 set of Quad-SPI, 2 sets of I2C, 1 set QEI and 1 set ECAP and finally 2 sets of analog comparators, up to 16 channels of 12-bit SAR ADC.
LQFP48 and 64 packages are available.
NXP unveiled two new series in the MXC Industrial and IoT MCUs portfolio.
The MXC-N is based on a dual 150 MHz Cortex-M33 with 512kB to 2MB Flash. The MCX N94x and N54x sport a DSP co-processor and an integrated eIQ Neutron NPU. The NPU delivers up to 42x faster machine learning throughput compared to a CPU core alone.
The MCX N94x offers a wider set of analog and motor control peripherals, while the MCX N54x family provides peripherals ranging from high-speed USB with a PHY to secure digital (SD) and smart card interfaces.
The MCX A14x (48MHz)/A15x (96MHz) Cortex®-M33 MCUs operate at up to 96MHz with high levels of integration and analog. They address a wide range of applications with scalable device options. The low power and intelligent peripherals include timers that generate three complementary PWM pairs with deadband insertion, 4Msps 12b ADC with hardware windowing and averaging features. The innovative power architecture is designed to support high utilization of I/Os and power efficiency with a simple supply circuit in a smaller footprint.
13 devices are available ranging from USD0.92 to USD1.50 @10k.
Renesas deployed the silicon revision #50 of R5F526T, a 32-bit MCU Optimized for Dual-Motor and PFC Control. Same for the RL78/L12, a LCD MCU for Small Appliances and Healthcare Devices.
No change.
ST released 23 new parts, all variants of existing devices.
TI released a couple of variants of the MM0L1306.
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