Semiconductor Products Insight

Semiconductor Products Insight

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late bloom

02

Dec

2019

New wireless devices bloomed late this year with both Dialog and Nordic semis releasing BT5.1 compatible devices either on the lower end (DA14531) or with all the bells and whistles (nRF52833 with direction finding). Interestingly, NXP “followed” the lead of Microchip this month with additional parts in the ARM9-based i.MX28 family. Back to the future?


Dialog
Dialog just released the SmartBond Tiny (DA14531) with BT5.1 support, based on a 16 MHz Cortex-M0+ core. It only requires 6 external passives a crystal and a power source (1.1 to 3.3V). It is available in WLCSP17 or FCGQFN24.
Infineon
No change.
Microchip
Microchip added 149 variant of existing parts. The ATSAML1x (20+ of them) got extended temperature (-40 to +125), 32 dsPIC33CH got -H revisions, while the ATSAMDA1E added 14 variants with new Flash sizes. Finally, a number of VAO (Automotive grade) parts made it out in the following families: PIC12, PIC16 PIC32, ATTiny16 and ATTiny 8.
Nordic
It had been a while since Nordic released a new product, and this time the nRF52833 is a general-purpose multiprotocol SoC with a Bluetooth 5.1 Direction Finding capable radio, qualified for -40°C to 105°C. It is the 5th addition to the nRF52 Series and is built around a 64 MHz Arm Cortex-M4 with FPU, and has 512kB flash and 128kB RAM. A 1:4 RAM to Flash ratio and +8 dBm output power make the nRF52833 suitable for advanced wearables or smart home applications where robust coverage is important.

It includes a range of analog and digital interfaces such as NFC-A, ADC, Full-speed 12 Mbps USB 2.0, High-speed 32 MHz SPI, UART/SPI/TWI, PWM, I2S and PDM, and has a 1.7 V to 5.5 V supply voltage range, which enables powering the device from rechargeable batteries or over USB. The two-stage LDO regulator and a DC-DC converter, together with the automated power management system help deliver low power numbers even in more advanced applications.

Nuvoton
No change.
NXP
NXP added more low-end parts to the K32 L2 MCU family. It is based on a low-leakage Cortex-M0+ core with options scaling from 64 KB to 512 KB Flash and from 32 kB to 128 kB SRAM. The new devices (K32L2B11 and K32L2B21) extend the portfolio toward the low-end with 64 and 128 kB of Flash. Of interest is the release of additional ARM9 based i.MX28.
What’s up with the ARM9 renewed interest?
Renesas
Renesas added 77 new variants of the RX71M and the RX64M, with a few new RX24T part numbers.
Renesas also unveiled the RL78/G13A a replacement for the G13, with much lower operating current (47μA/MHz: over 40% reduction from RL78/G13). They also support extended temperature range (105C). The 16 new parts are still under development.
SiliconLabs
No change this month.
Spansion/Cypress soon Infineon
Cypress added a BGA package to the PSoC6 (CY8C63xxBZI).
ST Microelectronics
ST disclosed a few variants of existing parts, the bulk of it with an UFQFPN package and 85C max temperature.
Texas Instruments
No significant change.
Newsletter |

When the future meets the past

04

Nov

2019

This month, Microchip revives an ARM classic in a hot-rod skin: 600MHz of adrenaline packed with a 24b LCD controller, camera interface and a class-D amplifier. At the same time, NXP beefs up its LPC55xx family and prefers to stick to the more recent (2016) and secure Cortex-M33. The future meets the past this month.


Dialog
No change.
Infineon
No change.
Microchip
Microchip added 36 variant of existing parts. The ATTiny 102/104 got a F extension for a fast startup time option, while the PIC16LF, PIC18LF and DSPIC33EP512 got their share of variants too.
But the most interesting change was the launch of the SAM9X60. The SAM9X60 sports a (wow) 600 MHz ARM926EJ-S with support for 16-bit LPDDR/DDR2, 32-bit LPSDR/SDRAM, NAND flash, Quad SPI and eMMC Flash. There is also a Secure Boot capability with on-chip secure key storage (OTP), high-performance crypto accelerators (SHA, AES and TDES) as well as tamper pins. For the younger folks, the ARM9 was created in 1998, so the appetite for Microchip to continue the classic ARM9 maybe a very low royalty rate. Additional features include:

  • 32/32 kB Data/Inst Cache
  • 64 kB internal SRAM
  • 24-bit LCD Controller with overlays up to 1024×768 resolution
  • 2D Graphics Engine, Camera Interface
  • Built-in Class D Amplifier
  • Dual 10/100 Ethernet, Dual CAN, Dual SD Card/eMMC
  • Two High-speed USB Host + One High-speed Host or Device
  • Thirteen FLEXCOMs (USART, SPI and I²C)
  • TFBGA228, 11×11, 0.65 mm pitch

Prices start at $4.67/10k.

Nordic
No change.
Nuvoton
M032LE3AE and M032SE3AE had their parametrics removed this month. Some challenges on this product line?
NXP
NXP has beefed up its LPC5500 series portfolio with another 16 parts. It is marked as in production but the site also mentions that “The remaining LPC5500 MCU series will be sampling throughout 2019-2020”. The series uses a 40nm process, and is based on the Cortex-M33 using the latest security features such as SRAM PUF-based root of trust and provisioning, real-time execution from encrypted images (internal flash), and asset protection with Arm TrustZone-M. Interestingly, it integrates a power management IC (DC-DC) and dedicated co-processors for signal processing and cryptographic acceleration.
Here is an overview of the ‘available’ series.

  • LPC55(S)6X: 100 or 150MHz, 320 or 640 KB of Flash and 2 USB controllers at -40-105C, S version embeds all the security functions
  • LPC55(S)2X: 100 or 150MHz, 256 or 512 KB of Flash and 2 USB controllers at -40-105C, S version embeds all the security functions
  • LPC55(S)1X: In preproduction, lower cost version with up to 256 kB of Flash, one or 2 USB controllers, little information available

NXP also added the LPC804UK, the bigger brother of the existing LPC802UK. Their distinctive feature is a WLCSP package.

Renesas
In the RL78 family, the F14 added 31 additional parts. These are available in a 30 to 100-pin, 48 to 256 KB flash memory lineup, have a built-in CAN module and LIN module for automotive interfaces, and also support BLDC motor control using the RL78/F13’s functional safety features, timer RD, comparator, and D/A converter. Same treatment for the F13 with 60 additional parts. Both are derived from automotive grade parts and have extended temperature range available (-40 to 105/125 and 150C).
On the RX side, the RX23E-A came out with 8 parts, equipped with a RXv2 core and an analog front end that can measure temperature, pressure, flow, and weight with less than 0.1% precision without calibration, making it ideal for high-precision sensing, test and measurement equipment. Other variants were added to the RX24T, RX24U, RX62T, RX651 and RX566T.
Renesas re-added the S5D3 group (120 MHz, 520kB Flash) from the portfolio. It was likely a glitch on the website.
SiliconLabs
No change this month.
Spansion/Cypress soon Infineon
Nothing significant this month.
ST Microelectronics
ST disclosed a few variants of existing parts, nothing earth shaking.
Texas Instruments
No significant change.
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