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December celebrates new core and USB-C
31
Dec
2018
Great to see continued activity in December with a nice RXv3 core integrated in new parts at Renesas as well as the STM32G0 getting its first part numbers with USB power delivery. Nuvoton annonced earlier new Cortex-M23 parts that we will detail next month. In the meantime, happy new year to our readers and looking forward to an exciting year with plenty of new cores, USB-C support, and growth for the microcontroller industry.
Atmel/Microchip
A handful of VAO (automotive-grade) parts appeared in the AVR family. Nothing for the SAM Cortex-M-based families.
A handful of VAO (automotive-grade) parts appeared in the AVR family. Nothing for the SAM Cortex-M-based families.
Dialog
No change.
No change.
Infineon
No significant change.
No significant change.
Microchip
Over 100 parts were added this month mostly to the DSPIC33CH (36 parts) and DSPIC33CK (62) families. The DSPIC33CH uses a dual-core architecture and targets motor control and industrial applications. The DSPIC33CK is its single-core cousin.
Over 100 parts were added this month mostly to the DSPIC33CH (36 parts) and DSPIC33CK (62) families. The DSPIC33CH uses a dual-core architecture and targets motor control and industrial applications. The DSPIC33CK is its single-core cousin.
Nordic
No change.
No change.
Nuvoton
Mea culpa for missing Nuvoton’s Cortex-M23 announcement back in the fall. There is a complete micro-site that provides information on the new Series. We are upgrading our indexers to prevent this to happen again.
On a separate token, Nuvoton unveiled 30 new parts in the new M480 Series: 192MHz Cortex-M4, up to 512 KB of dual bank Flash memory, up to 160 KB of SRAM memory, Quad-SPI interface with XIP (Execute in Place), and 16-bit I80 QVGA LCD support. Here are the sub-families:
Mea culpa for missing Nuvoton’s Cortex-M23 announcement back in the fall. There is a complete micro-site that provides information on the new Series. We are upgrading our indexers to prevent this to happen again.
On a separate token, Nuvoton unveiled 30 new parts in the new M480 Series: 192MHz Cortex-M4, up to 512 KB of dual bank Flash memory, up to 160 KB of SRAM memory, Quad-SPI interface with XIP (Execute in Place), and 16-bit I80 QVGA LCD support. Here are the sub-families:
- M481 – 192 MHz PWM, dual 200 Mbps SDHC, 5 MSPS ADC, and 1 MSPS DAC.
- M482 – USB 2.0 Full Speed device/host/OTG with integrated FS transceiver and 1 KB data buffer.
- M483 – Dual CAN 2.0B, dual USB supporting High Speed (HS) OTG and Full Speed (FS) OTG
- M484 –USB 2.0 High Speed device/host/OTG with integrated HS transceiver and 4 KB data buffer, USB 2.0 Full Speed device/host/OTG with integrated FS transceiver and 1 KB data buffer.
- M485 – Hardware cryptography accelerator engine including ECC-256, AES-256, and SHA-512, random number generator, and dual USB 2.0 device/host/OTG.
- M487 – 10/100M Ethernet MAC with RMII/MDC/MDIO interface, hardware cryptography engine, dual CAN 2.0B
NXP
It was an inhabitual quiet month for NXP.
It was an inhabitual quiet month for NXP.
Renesas
Renesas unveiled the RXv3 core late october, and we are now seeing 80 new parts numbers with he R5F566T prefix. The new MCUs are designed to address the real-time performance and enhanced stability required by motor control and industrial applications in next-generation smart factory, smart home and smart infrastructure equipment.
The RXv3 core boosts the RX architecture with up to 5.8 CoreMark®/MHz. The RXv3 core is backwards compatible with the RXv2 and RXv1 CPU cores in Renesas’ current 32-bit RX MCU families.
The RXv3 core will enable the first new RX600 MCUs to achieve 44.8 CoreMark/mA with an energy-saving cache design. Renesas plans to start sampling shipments of RXv3-based MCUs before the end of Q4 2018.
Renesas unveiled the RXv3 core late october, and we are now seeing 80 new parts numbers with he R5F566T prefix. The new MCUs are designed to address the real-time performance and enhanced stability required by motor control and industrial applications in next-generation smart factory, smart home and smart infrastructure equipment.
The RXv3 core boosts the RX architecture with up to 5.8 CoreMark®/MHz. The RXv3 core is backwards compatible with the RXv2 and RXv1 CPU cores in Renesas’ current 32-bit RX MCU families.
The RXv3 core will enable the first new RX600 MCUs to achieve 44.8 CoreMark/mA with an energy-saving cache design. Renesas plans to start sampling shipments of RXv3-based MCUs before the end of Q4 2018.
SiliconLabs
The Happy Gecko family received extended temp parts (-40 to +105), 18 parts.
The Happy Gecko family received extended temp parts (-40 to +105), 18 parts.
Spansion/Cypress
Cypress has only minor changes this month.
Cypress has only minor changes this month.
ST Microelectronics
ST just exposed 24 new STM32G0 parts. It features the first USB-C power delivery we have seen in a Cortex-M based MCU. Here is the summary from last month.
ST announced the creation of the STM32G0 series, just above the rock-bottom STM32F0 series. ST focuses on BOM cost reduction, performance, consumption and integration. Package options range from 8 to 100 pins and Flash from 16 to 512 kB. The G0 offers a 33% bump in frequency compared to the F0 from 48 to 64MHz. Support for USB-C is available on some parts to support high-speed connectivity and battery charging. Power consumption is lower than 100µA/MHz in run mode, 3-8µA in stop mode, and just 500nA in standby, but we couldn’t find any ULPBench results. ST also made the G0 more ESD resistant with compliance with IEC 61000-4-4. Security is not forgotten with the STM32G0x1 that add crypto. Pricing starts at $0.69@10k for the STM32G070CBT6 48-pin, 128kB Flash.
ST just exposed 24 new STM32G0 parts. It features the first USB-C power delivery we have seen in a Cortex-M based MCU. Here is the summary from last month.
ST announced the creation of the STM32G0 series, just above the rock-bottom STM32F0 series. ST focuses on BOM cost reduction, performance, consumption and integration. Package options range from 8 to 100 pins and Flash from 16 to 512 kB. The G0 offers a 33% bump in frequency compared to the F0 from 48 to 64MHz. Support for USB-C is available on some parts to support high-speed connectivity and battery charging. Power consumption is lower than 100µA/MHz in run mode, 3-8µA in stop mode, and just 500nA in standby, but we couldn’t find any ULPBench results. ST also made the G0 more ESD resistant with compliance with IEC 61000-4-4. Security is not forgotten with the STM32G0x1 that add crypto. Pricing starts at $0.69@10k for the STM32G070CBT6 48-pin, 128kB Flash.
Texas Instruments
TI has only minor changes this month.
Newsletter |
TI has only minor changes this month.
ST vs. NXP, the battle continues
12
Dec
2018
This month is overwhelmed with a phethora of annoucements from our 2 shining MCU stars: NXP and STMicroelectronics. The former announced 2 high innovation families using the latest Cortex-M33, one flashless, focused on high performance for voice enabled applications and using custom DSP accelerators while the other delivering security to the mass market. ST continues its coverage of the low end with the release of the STM32G0 geared toward higher integration, lower cost and power consumption while keeping up with the latest USC-C specs. ST also closed the gap on the lower Flash density for its Cortex-M4 STM32L4 family.
Atmel/Microchip
Interesting to see the status of the AVR family fluctuate from mature to in production but it is clearly referenced in the legacy section. Also of interest are the new SAMC2 and SAMD2 part numbers, in all 29 parts mostly extended temperatures.
Finally, Microchip unveiled the new SAMR3 family, serving the LoRa wireless protocol market with USB (SAMR34) or without (SAMR35). These devices are SiP (System in Package) consiting of a sub-GHz front end coupled with a 48-MHz Cortex-M0+ MCU, up to 20 dBm output power and down to 790 nA in standby. Prices range from $3.74 to $4.33 @5k.
Interesting to see the status of the AVR family fluctuate from mature to in production but it is clearly referenced in the legacy section. Also of interest are the new SAMC2 and SAMD2 part numbers, in all 29 parts mostly extended temperatures.
Finally, Microchip unveiled the new SAMR3 family, serving the LoRa wireless protocol market with USB (SAMR34) or without (SAMR35). These devices are SiP (System in Package) consiting of a sub-GHz front end coupled with a 48-MHz Cortex-M0+ MCU, up to 20 dBm output power and down to 790 nA in standby. Prices range from $3.74 to $4.33 @5k.
Dialog
No change.
No change.
Infineon
No significant change.
No significant change.
Microchip
Microchip added another 20 VAO parts across the board, continuing its investment into the automotive space. There were also some mysterious /M5 parts with “null” packages. According to distributors information, these seem to be UQFN packages.
Microchip added another 20 VAO parts across the board, continuing its investment into the automotive space. There were also some mysterious /M5 parts with “null” packages. According to distributors information, these seem to be UQFN packages.
Nordic
No change.
No change.
Nuvoton
No change.
No change.
NXP
NXP released a few more part in the i.MXRT106x family with dual Ethernet ports, running at 528 and 600 MHz.
The bigger news was around 2 new families:
NXP released a few more part in the i.MXRT106x family with dual Ethernet ports, running at 528 and 600 MHz.
The bigger news was around 2 new families:
- The i.MX RT600 is based on the Cortex-M33 and embeds a Cadense Xtensa Hi-Fi 4 DSP core at up to 600MHz to address the booming voice enabled and voice recognition market. The 28nm FD-SOI family is apparently flashless with up to 4.5MB of SRAM and Octa/Quad SPI with an on-the-fly decryption engine. Unfortunately, there is little information on the part numbers yet.
- The LPC5500 features the same Cortex-M33 but using a 40nm embedded Flash process at 100MHz, it is composed of 7 families. The first one, sampling now, adds a non secured Cortex-M33 co-processor and includes up to 640kB of Flash, 320kB of RAM and 128kB of boot ROM. NXP is still evasive on the part numbers as well as the pricing.
Renesas
No significant change.
No significant change.
SiliconLabs
No change.
No change.
Spansion/Cypress
Cypress has introduced 25 new parts in the FM4 family, alas they are not described in the nomenclature with their M suffix. Information is limited but they might be newer revisions of existing non-M parts, see for instance the S6E2HE6G0AGV2000m. An additional 30 -40 to 105C parts were released, primarily in the PSoC4 family.
Cypress has introduced 25 new parts in the FM4 family, alas they are not described in the nomenclature with their M suffix. Information is limited but they might be newer revisions of existing non-M parts, see for instance the S6E2HE6G0AGV2000m. An additional 30 -40 to 105C parts were released, primarily in the PSoC4 family.
ST Microelectronics
ST announced the creation of the STM32G0 series, just above the rock-bottom STM32F0 series. ST focuses on BOM cost reduction, performance, consumption and integration. Package options range from 8 to 100 pins and Flash from 16 to 512 kB. The G0 offers a 33% bump in frequency compared to the F0 from 48 to 64MHz. Support for USB-C is available on some parts to support high-speed connectivity and battery charging. Power consumption is lower than 100µA/MHz in run mode, 3-8µA in stop mode, and just 500nA in standby, but we couldn’t find any ULPBench results. ST also made the G0 more ESD resistant with compliance with IEC 61000-4-4. Security is not forgotten with the STM32G0x1 that add crypto. Pricing starts at $0.69@10k for the STM32G070CBT6 48-pin, 128kB Flash.
Following on the announcement of the STL0x0 value line last month, ST released 6 new parts there, while the bulk of additions was in the STM32L4x2 side, a new set of parts numbers extending the STM32L4 to the lower end with 64 to 128kB Flash. It is proposed with crypto (STM32L422) or without (STM32L412) and ranges from LQFP32 to BGA64 in 5x5mm or WLCSP36 (2.58×3.07 mm).
ST announced the creation of the STM32G0 series, just above the rock-bottom STM32F0 series. ST focuses on BOM cost reduction, performance, consumption and integration. Package options range from 8 to 100 pins and Flash from 16 to 512 kB. The G0 offers a 33% bump in frequency compared to the F0 from 48 to 64MHz. Support for USB-C is available on some parts to support high-speed connectivity and battery charging. Power consumption is lower than 100µA/MHz in run mode, 3-8µA in stop mode, and just 500nA in standby, but we couldn’t find any ULPBench results. ST also made the G0 more ESD resistant with compliance with IEC 61000-4-4. Security is not forgotten with the STM32G0x1 that add crypto. Pricing starts at $0.69@10k for the STM32G070CBT6 48-pin, 128kB Flash.
Following on the announcement of the STL0x0 value line last month, ST released 6 new parts there, while the bulk of additions was in the STM32L4x2 side, a new set of parts numbers extending the STM32L4 to the lower end with 64 to 128kB Flash. It is proposed with crypto (STM32L422) or without (STM32L412) and ranges from LQFP32 to BGA64 in 5x5mm or WLCSP36 (2.58×3.07 mm).
Texas Instruments
TI beefed up again their wireless portfolio in the Simple Link family, with a handful of Cortex-M4 Bluetooth devices, the CC2652R1FRGx.
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TI beefed up again their wireless portfolio in the Simple Link family, with a handful of Cortex-M4 Bluetooth devices, the CC2652R1FRGx.
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