Semiconductor Products Insight

Semiconductor Products Insight

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Keremi tracking more MCUs, MCHP invests in automotive

30

Apr

2018

We are initiating coverage of the NXP QN90xx Bluetooth family as well as the NXP i.MX RT, a high performance Cortex-M7, and the Cortex-M-based Renesas Synergy MCUs with a few others in the pipeline. Microchip seems to be investing in automotive, with no less than 900+ new automotive qualified parts released. Enjoy!


Atmel/Microchip
AT32UC3 lost another 40 parts, and fewer than 90 remain while ATMEGA gained 25. On the Cortex-M front, the ATSAMS70 got a revision B of the silicon and is being swapped with the A revision.
Dialog
No change.
Infineon
No change.
Microchip
There was a significant push in the automotive space with 921 new parts that are declared automotive grade with a VAO suffix, with heavy representation of DSPIC33 and PIC16. If you are interested, here is a detailed presentation on the topic.
Nordic
No change.
Nuvoton
No change.
NXP
NXP released the LPC51U, a LPC541xx pin-compatible family now in pre-production. 2 parts are offered, with a 100MHz Cortex-M0+, 256kB/96kB of Flash/SRAM, a Full-Speed USB, in LQFP48 and 64 pins packages.
We are starting to track this month the QN90xx families, supporting the Bluetooth low power segment. They are split between the QN908x serving BT5.0 with a Cortex-M4 while the QN902x focuses on BT4.2 with a Cortex-M0. It is unclear from the documentation whether this is a single core solution with the Cortex-M dealing with both the application code and the modem code, or whether there is a hidden additional processor running the modem function. Interestingly, on the QN908x, there is a fusion sensor processor, essentialy a hardware block that can perform low level DSP function like 9×9 matrix multiplication, 64 to 256-point FFT-type operations.
We are also initiating coverage on the i.MX RT family, a high performance Cortex-M7 based family bridging the gap between MCUs and application processors. The family comes in 3 flavors from 256kB to 1MB of RAM, but no embedded Flash. The family rely on a quad-SPI and a parallel interface to external NAND or NOR Flash memories. Additional features include a 2D graphics acceleration engine, a parallel camera sensor interface, a LCD display controller (up to WXGA 1366×768) and 3x I2S interfaces for audio streams. Devices run at 528 or 600MHz with a starting price below $3/10k.

Renesas
We are initiating coverage of the Synergy platform, a full solution offer of Renesas America. The platform includes silicon but also Synergy software packages well beyond a basic BSP, tools kits and a list of partners. We focus on the silicon part that Renesas has split in 4 series, interestingly, all of them include at a minumum a USB controller and AES128/256:
– S1 ultra-low power, Cortex-M0+, 32MHz, 64-256 kB FLash
– S3 high efficiency, Cortex-M4, 48MHz, 130nm process, 256-1024 kB Flash, segment LCD and touch
– S5 high integration, Cortex-M4, 120MHz, 512-2048 kB Flash, graphic LCD, Ethernet
– S7 high performance, COrtex-M4, 240MHz, 3072-4096 kB Flash
SiliconLabs
SiLabs expanded the Giant Gecko GG11, Series 1 family with now 60 EFM32GG11 parts. The GG11 Series 1 uses a Cortex-M4 core running at 72 MHz (80µA/MHz in active mode) with combinations of 1 or 2 MB of Flash with 512 or 384 kB of RAM a solid crypto engine with AES128/256, SHA1/2 and ECC, Ethernet and USB support on selected parts. It was announced in July last year with pricing starting at $5.66/10k.
On the wireless side, the EZR32HG220F lost 5 parts while the EFR32BG13P gained 4 and the EFR32MG13P gained 3.
Spansion/Cypress
Cypress is migrating its MB9BF (FM4 parts) to a new nomenclature, replacing MB with CY to have CY9BF parts.
ST Microelectronics
STM32 had only minor changes. The STM32WB55 now shows 5 devices with -40/+85 and -40/+105 temperature grades.
Texas Instruments
TI had minor changes.
Newsletter |

A wireless spring in the making

31

Mar

2018

The wireless spring continues with ST and NXP jumping into the BlueTooth/Thread/Proprietary protocol-dual-core-single-chip arena. There was also some cleanup at Microchip in the Atmel portfolio where the Cortex-M3 parts were taken into NRND. Enjoy Easter everybody.


Atmel/Microchip
Microchip just got rid of its Cortex-M3 based ATSAM families the ATMSAM3A/N/S/U/X. Stuck betwen a smaller and more efficient Cortex-M0+ and a more powerful Cortex-M4, the Cortex-M3-based family may not have gathered enough support. A few SAM4 and SAME got additional package options while the SAME70 lost 15 part numbers, rest assured, there are over 40 left.
Dialog
No change.
Infineon
No change.
Microchip
There were 37 new temperature/package variations of existing parts in the PIC16F and PIC32MM/MZ families.
34 more products were removed in the DSPIC33 and PIC24 families, it was 27 last month. A slow bleeding?

Nordic
No change.
Nuvoton
No change.
NXP
It was an interesting couple of months for NXP with the unveiling of system in package solutions based on i.MX (Cortex-A7) and Wifi/BlueTooth at Embedded World 2018.
Another interesting development is the announcement of the K32W0x wireless platform. Based on a Cortex-M4 for application and a Cortex-M0+ core for low-power connectivity and sensor processing, it embeds 1.25MB/384kB of Flash/SRAM. The K32W0x supports BT5, 802.15.4 and Zigbee 3.0, comes in VFBGA176/WLCSP191 packages and is sampling now with production by Q3E. Limited documentation is available.
The wireless segment is heating up.
Renesas
No significant change.
SiliconLabs
SiLabs expanded the Tiny Gecko family with the new EFM32TG11. The 46 new parts embed a 48MHz Cortex-M0+ (37 µA/MHz in active mode), hardware accelerated crypto functions (AES/SHA, CRC, TRNG), one CAN, 64 or 128kB of Flash and an optional LCD controller. The EFM32TG11 starts at USD1.65/10k.
Spansion/Cypress
Cypress had a new silicon revision for the S6E2C family while adding variants to the PSoC4 added new package combinations. 33 new products appeared overall.
ST Microelectronics
STM32 had a few changes, including the addition of an extended temperature version of the STM32F765.
The more interesting news was the announcement of the STM32WB a family combining – guess? – a Cortex-M4 for the application and a Cortex-M0+ core for the wireless modem functions – BT5 and 802.15.4 supporting OpenThread, ZigBee, or proprietary protocols. The STM32WB is an evolution of the STM32L4 series.
Engineering samples of the STM32WB in packages up to 100-pin WLCSP are sampling now, priced from $1.56 for high-volume orders.
The 2.4GHz radio consumes 5.5mA in TX and 3.8mA in RX mode.
STM32WB devices include UQFN48, VQFN68, or WLCSP100 and 256/128kB, 512/256kB and 1MB/256kB Flash/RAM options.
Like NXP, there is only limited documentation although ST feels more verbose and clear on their intentions.
The wireless segment is… heating up!
Texas Instruments
TI had a mini reshuffle of their MCU portfolio. Performance MCUs are gone and split into ‘Other MCUs’ and C2000 Real Time Control. Wouldn’t like to be the Tiva, moving into the former.
Remember that TI had its wireless moment last month with a now popular architecture…
[From last month] TI released 13 new wireless MCU worth mentionning. They are dual-core Cortex-M0 (modem) / Cortex-M4 (application) combos with integrated RF:
CC1312R: sub-GHz
CC1352R: sub-GHz and 2.4 GHz
CC2642R: 2.4GHz, Bluetooth 5.0
CC2652R: 2.4GHz, Multi-protocol

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