Nuvoton new ReRAM
30
Oct
2023
Nuvoton is using an innovative non-volatile memory, the ReRAM to replace flash in its newest Cortex-M-based line of products. This was developed when Nuvoton was still Panasonic Semiconduct Solutions. Fujitsu developed a 12 Mbits product last year, based on Nuvoton’s technology. ReRAM seems to be catching on with multiple startups focused on the technology, including Weebit and Crossbar. According to Nuvoton, ReRAM provides key advantages compared to traditional Flash, including fast read/write speeds, low power consumption, and superior durability. Let’s hope for success of ReRAM in the low power MCU market.
Infineon added 15 new part numbers as it created the PSoC™ 4000T series, expanding the PSoC™ 4 Cortex-M0+ based microcontrollers family. It features Infineon’s 5th Generation high-performance CAPSENSE™ capacitive sensing technology with 10x higher SNR and 10x lower consumption than previous generations of CAPSENSE™.
PSoC™ 4000T series targets low-power applications including wearable, hearable, and smart connected IoT devices. Here is the overview of the PSoC 4000T:
- 48-MHz Arm® Cortex®-M0+ CPU with single-cycle multiply
- Up to 64/8 kB of flash/RAM
- CAPSENSE™ technology; supports both, self and mutual capacitive sensing techniques with up to 16 self-capacitive inputs or 64 mutual-capacitive inputs
15 part numbers were released. There were also 7 new variants in the CY8C414x family (Auto PSoC 4S-Series).
Microchip added 78 new part numbers mostly in the ATTiny, AVR16, DSPIC33C (with the VAO suffix for Automotive support), and PIC18F.
No change.
Nuvoton released the M2L31 Series, a 72 MHz Cortex-M23 based group targeting Motor Control, PC Peripherals, Industrial Automatic, Battery Management System applications. It sports 64 to 512 Kbytes ReRAM, 40 to 168 Kbytes SRAM, 1.71V to 3.6V operating voltage, -40°C to 105°C wide operating temperature, a variety of packages choices, and high immunity characteristics by 4 kV ESD HBM and 4.4 kV EFT.
ReRAM (Resistive Random-Access Memory) is a type of non-volatile memory that achieves digital data storage by altering the resistance state of its components through the application of an external voltage. It boasts three major characteristics: fast read/write speeds, low power consumption, and superior durability, making it hailed as the next-generation embedded universal memory. Unlike embedded flash memory, ReRAM doesn’t require an page erase operation before writing, resulting in faster write speeds and a more straightforward and speedy operation similar to EEPROM. Furthermore, ReRAM consumes less energy for storing each bit compared to what is needed in flash memory. Additionally, because each storage unit can be individually set or reset, it offers greater endurance than flash memory.
The M2L31 series provides up to three Programmable Gain Amplifiers (PGA) to amplify the small voltage, three comparators in conjunction with PWM to ensure cycle-by-cycle over current limiting for increased application safety and robustness, one 24-ch high-speed 3.6 MSPS 12-bit SAR ADC, up to two 12-bit 1 MSPS DAC to provide precise voltage reference to other analog device, 12-ch 16-bit 72MHz PWM and up to 12-ch 16-bit 144MHz EPWM.
The M2L31 series includes one controller compliant with USB Type-C Rev. 2.1 and USB Power Delivery Rev. 3.0 specifications. The controller featuring USB Type-C pull-high and pull-low resistors, Dead battery and fast role swap supported, and flexible Power Delivery along with data transmission over a single cable.
The M2L31 series provides a variety of peripherals such as RTC with independent VBAT pin, up to 16 channels of PDMA, up to 16 independent capacitive touch key sensing, up to 2 sets of CAN FD controller, USB 2.0 FS OTG Host and device controllers, up to 8 sets of UART, up to 4 sets of I²C, up to 4 sets of SPI/I2S,1 set of QSPI, and 2 sets of Universal Serial Control Interfaces (USCI).
Supported packages include WLCSP 25 (2.5 mm x 2.5 mm), QFN32 (5 mm x 5 mm), LQFP48 (7 mm x 7 mm), QFN 48 (5 mm x 5 mm), WLCSP 49 (3.0 mm x 3.0 mm), LQFP64 (7 mm x 7 mm), and LQFP128 (14 mm x 14 mm).
No change.
Renesas was quite prolific this month, with 30 new RA part numbers, all variants of existing parts, 121 new products in the RL78 family mostly with new revisions of existing parts.
No change.
ST had only minor changes to its portfolio with 22 new variants across various families.
TI had a few new Cortex-M0+ from the MSPM0L/G Cortex-M0+ MCUs, but these were samples with an X prefix. 9 parts in total. The Delfino 28x got also 13 new parts, F28001xx.
SiLabs beefs up BLE portfolio
30
Sep
2023
SiLabs continues to provide innovative solutions for the IoT market with, this month, a radio co-processor optimized for gateways, hubs and access points for the BLE and Zigbee protocols in the 2.4 GHz band.
Renesas added a new group to the RL78 with an embedded “Flexible Application Accelerator”. The new RL78/G24 group targets motor control, power supply, and lighting applications.
No significant change.
Microchip added 48 new part numbers mostly in the PIC16 and PIC18 families, all being variants with new packages, temperature or packing of existing parts.
No change.
Nuvoton released high temperature versions for the M467 Ethernet/Crypto series. It is a 32-bit microcontroller based on Arm Cortex-M4F core, with DSP instruction set and single-precision floating-point unit (FPU), targeted for IoT gateway, industrial control, telecom, and data center applications. The M467 Ethernet/Crypto series runs up to 200 MHz, and features 1.7 V to 3.6 V wide operating voltage.
No change.
Renesas released 88 new products in the RL78 family in particular into the existing RL78/G23 and the new group RL78/G24.
The RL78/G24 group has the highest processing performance of the RL78 family of MCUs, with a CPU operating frequency up to 48 MHz and a flexible application accelerator (FAA). In addition, the enhanced analog functions and timers make it a good fit for motor control, power supply, and lighting applications. The FAA is a co-processor dedicated to arithmetic operations, and can be operated independently of the CPU, delivering higher processing power.
Main features include:
- CPU: RL78 core, Max. 48MHz, FAA core
- Voltage: 1.6V to 5.5V
- Package: 20-pin to 64-pin
- Memory: Program Flash: 64/128KB, SRAM 12KB, Data Flash 4KB
- Operating temperature range:-40 up to 125°C
- Timer: 16-bit Timer (ch) x 12, Watchdog Timer (ch) x 1, 32-bit Interval Timer x 1 ch
- Analog function: 8/10/12-bit A/D Converter (ch) x 23, 8/10-bit D/A – Converter (ch) x 2~3, Comparator x 4, Programmable gain amplifier (PGA) x 1
- Packages: SSOP, LQFP, LFQFP, HWQFN, WFLGA
The RX26T got 24 new parts, mostly variants.
The EM35x got EOLed, and a couple of interesting products were introduced:
The EFR32BG24B310F1536IJ42 with a CSP package is focused on BLE connectivity for clinical and portable medical, smart home, and lighting devices. It has received the highest PSA Certification Level 3 security. It features a Cortex-M33 core with 1536 kB Flash, 256 kB of RAM and 20 GPIO.
The EFR32MR21A020F512IM32 on the other side, is a wireless RCP (Radio Co-Processor) device that has been optimized for gateways, hubs, and access points. Based on the MG21 family, the MR21 runs the PHY/MAC for 802.15.4 and up to the HCI interface for Bluetooth Low Energy. For products that already have a separate host MCU or MPU, the RCP device enables lower hardware cost by reducing the requirements of the wireless IC and allowing the wireless protocol and application to run on the existing host MCU/MPU. The MR21 device includes 512 Flash, 64 RAM and is available in a QFN32 package. With +20 dBm maximum power output and excellent receive sensitivity the EFR32MR21A020F512IM32 provides a robust RF link for reliable communications.
ST had only minor changes to its portfolio.
TI was rather quiet this cycle with no changes to its portfolio of ultra low cost MSPM0L/G Cortex-M0+ MCUs.
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